发明名称 |
Prefabricated semiconductor chip carrier |
摘要 |
A semiconductor die carrier includes a plurality of electrically insulative side walls; a plurality of electrically conductive leads extending from at least one of the side walls, each of the leads being individually manufactured without use of a lead frame; a semiconductor die positioned such that the electrically conductive leads are disposed at one or more locations around the periphery of the die; and structure for providing electrical connection between the semiconductor die and corresponding ones of the electrically conductive leads. A method of manufacturing a semiconductor die carrier includes the steps of individually manufacturing a plurality of electrically conductive leads without use of a lead frame; extending a plurality of the electrically conductive leads from at least one of a plurality of electrically insulative side walls; positioning a semiconductor die such that the electrically conductive leads are disposed at one or more locations around the periphery of the die; and electrically connecting the semiconductor die to corresponding ones of the electrically conductive leads.
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申请公布号 |
US6977432(B2) |
申请公布日期 |
2005.12.20 |
申请号 |
US20040755414 |
申请日期 |
2004.01.13 |
申请人 |
QUANTUM LEAP PACKAGING, INC. |
发明人 |
CRANE, JR. STANFORD W.;PORTUONDO MARIA M. |
分类号 |
H01L23/50;H01L21/44;H01L23/057;H01L23/48;H01L23/498;H05K1/18;H05K3/34;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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