发明名称 |
MEMS microcapillary pumped loop for chip-level temperature control |
摘要 |
A microcapillary pumped loop (CPL) for chip level temperature control includes two mating substrates which define an evaporator, a condenser, and a reservoir for a liquid. A first substrate includes a vapor line which couples vapor from the evaporator to the condenser, and a liquid line which couples liquid from the condenser back to the evaporator. A wicking structure for the evaporator is formed by etching in the second substrate. The wicking structure couples the evaporator to the reservoir and to the liquid line. The condenser includes a plurality of grooves formed in the second substrate which couples liquid from the condenser to the liquid line.
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申请公布号 |
US6976527(B2) |
申请公布日期 |
2005.12.20 |
申请号 |
US20020198626 |
申请日期 |
2002.07.16 |
申请人 |
THE REGENTS OF THE UNIVERSITY OF CALIFORNIA |
发明人 |
KIRSHBERG JEFFREY;YERKES KIRK L.;LIEPMANN DORIAN |
分类号 |
F28D15/04;H01L23/427;(IPC1-7):F28D15/00 |
主分类号 |
F28D15/04 |
代理机构 |
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代理人 |
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地址 |
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