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发明名称
DIE BONDER HAVING WEIGHT SCALE AND METHOD OF DIE BONDING USING THE SAME
摘要
申请公布号
KR20050118938(A)
申请公布日期
2005.12.20
申请号
KR20040044096
申请日期
2004.06.15
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
HONG, SUNG BOK;KIM, DAE SOO;KIM, DONG BIN;LEE, SUNG HEE;LEE, JIN PYO
分类号
H01L21/52;(IPC1-7):H01L21/52
主分类号
H01L21/52
代理机构
代理人
主权项
地址
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