发明名称 Sockets for module extension and memory system using same
摘要 A through socket includes a socket body, which can load the plurality of memory modules, and a plurality of internally connected socket conductors arranged to electrically connect the memory modules when loaded. A turn around socket includes a socket body for loading at least one memory module and connecting a contact of one surface of a loaded memory module to a contact of the other surface. Using at least one through socket and at least one turn around socket, the memory system can extend a plurality of memory modules on a printed circuit board (PCB). A memory module adapted for use in the memory system has four contacts arranged at both ends and on both surfaces.
申请公布号 US6976848(B2) 申请公布日期 2005.12.20
申请号 US20040006981 申请日期 2004.12.07
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI JUNG-HWAN
分类号 H01R33/76;H05K1/14;(IPC1-7):H01R12/00 主分类号 H01R33/76
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