发明名称 |
Sockets for module extension and memory system using same |
摘要 |
A through socket includes a socket body, which can load the plurality of memory modules, and a plurality of internally connected socket conductors arranged to electrically connect the memory modules when loaded. A turn around socket includes a socket body for loading at least one memory module and connecting a contact of one surface of a loaded memory module to a contact of the other surface. Using at least one through socket and at least one turn around socket, the memory system can extend a plurality of memory modules on a printed circuit board (PCB). A memory module adapted for use in the memory system has four contacts arranged at both ends and on both surfaces.
|
申请公布号 |
US6976848(B2) |
申请公布日期 |
2005.12.20 |
申请号 |
US20040006981 |
申请日期 |
2004.12.07 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHOI JUNG-HWAN |
分类号 |
H01R33/76;H05K1/14;(IPC1-7):H01R12/00 |
主分类号 |
H01R33/76 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|