| 摘要 |
Disclosed is a fabrication method for a non-volatile semiconductor memory device that comprises a pattern forming step in which by using a first mask layer and a second mask layer formed in a common lithography step as masks, a pattern is formed from a second layer, a third layer, a fourth layer, a sixth layer and a protection layer in a laminated substrate having, in a memory cell area, a sequential lamination of a first layer for forming a first insulating layer, the second layer for forming a floating gate, the third layer for forming an intergate insulating layer, the fourth layer for forming a control gate and a first mask layer, and having, in a logic area, a sequential lamination of a fifth layer for forming a second insulating layer, the sixth layer for forming a logic gate, the protection layer for protecting the sixth layer at the time of forming the control gate and a second mask layer. The fabrication method can fabricate a non-volatile semiconductor memory device by forming layers in a self-aligned manner with respect to a gate electrode while minimizing an alignment error and a chip size.
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