| 摘要 |
<p>1,066,959. Soldering; welding by pressure. PHILCO-FORD CORPORATION. Aug. 19, 1964 [Aug. 19, 1963], No. 33954/64. Heading B3R. [Also in Division H1] A semi-conductor device 20 is mounted in a closed housing made in two parts one of which, 17, is secured to the device and the other, 15, to a generally straight leadout wire 12. The wire 12 of iron-nickel-cobalt alloy copper-plated is secured to but insulated from the housing part 15 before attachment of the latter to the part 17. Initially the wire end carries a blob 24 of lead or other fusible conductive material and, by means of a jig comprising the plates 30 and 31, the housing part 15 is located in either the full line or broken line position of Fig. 2 above the housing part 17. On heating, the blob 24 melts and the housing parts move together under gravity until the flanges 16 and 18 are in contact. The two housing parts may be sealed to each other by use of a welding apparatus 25 (Fig. 5, not shown) consisting of two tubes (26, 27) between the ends of which the contacting flanges are located, the welding current being passed from one tube to the other through the intervening flanges.</p> |
