发明名称 Electronic component mounting apparatus and electronic component mounting method
摘要 The invention prevents mismounting of an electronic component caused by missetting of a component feeding unit in an apparatus. A recognition process of an electronic component is performed according to component library data stored in a RAM. According to "normal" data as a check condition in the component library data, a recognition processing device checks whether leads indicated by group numbers "1" and "2" exist or not in the electronic component, on command of a CPU. When all the leads are detected, the CPU commands the recognition processing device to calculate an amount of shifting from a proper position based on an image taken by a component recognition camera, and a position and an angle of the electronic component are calculated. Next, the recognition processing device performs an absence check of leads which must not exist in the electronic component. When even one of the leads which must not exist is detected, the CPU judges the electronic component the "lead detection error in absence check", so that the CPU makes the electronic component released from a suction nozzle and collected in an exhaust box.
申请公布号 US2005274004(A1) 申请公布日期 2005.12.15
申请号 US20050134498 申请日期 2005.05.23
申请人 HITACHI HIGH-TECH INSTRUMENTS CO., LTD. 发明人 YOSHII TAKASHI;URAKAWA AKIHIRO
分类号 H05K13/04;H05K13/08;(IPC1-7):B23P19/00 主分类号 H05K13/04
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