| 摘要 |
A semiconductor apparatus comprises a circuit board on which a plurality of wiring patterns are formed, a semiconductor device having a plurality of bumps electrically connected to the wiring patterns, the semiconductor device being mounted onto the circuit board via the bumps, the wiring patterns including a pair of wiring patterns for measuring connection resistance, and the pair of wiring patterns having tip portions which are arranged with a gap therebetween and connected to one of the bumps. |
