| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit device capable of easily forming a terminal area for connecting wiring layers mutually, and to provide its manufacturing method. <P>SOLUTION: In the manufacturing method of a hybrid integrated circuit device 10, a first resin film 17B1 is formed so as to cover a first wiring layer 18A. Then, a first penetrating hole is formed by penetrating the first resin film 17B1 so as to expose the first wiring layer 18A from the bottom. Next, a second resin film 17B2 is formed so that a first penetrating hole 32A may be embedded. Moreover, a terminal area 25 is formed by forming a second penetrating hole 32B in a second resin film 17B filled up with a second penetrating hole 32A. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
