| 摘要 |
PROBLEM TO BE SOLVED: To provide an automatic design method that can shorten a processing time, prevent a decrease in yield and reliability, and manufacture a semiconductor device having high wiring effectiveness, as well as a semiconductor integrated circuit that can be produced by using this method. SOLUTION: The automatic design method includes a step in which an automatic arrangement module 10 automatically arranges a first wiring pattern 110a, a second pattern 130a that is drawn obliquely against the first wiring pattern 110a's longitudinal direction on an upper layer of the first wiring pattern 110a, and a first via pattern 120a at a crossing point of the first wiring pattern 110a and the second wiring pattern 130a, a step in which a double cut via preparation module 20 prepares a double cut via 150a and stores it into a double cut via data file 63, and a step in which a double cut via substitution module 30 substitutes a most suitable double cut via 150a based on the graphic environment around the first via pattern 110a. COPYRIGHT: (C)2006,JPO&NCIPI |
