| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly accurate pressure sensor of a new constitution superior in resistance to corrosion and capable of compact formation. SOLUTION: A pressure sensor chip 20 is mounted to the upper surface of a circuit chip 1, and the circuit chip 1 has a pad (4a) in a region to which the pressure sensor chip 20 is not mounted in the upper surface. A sheet 31 made of a resin of a flexible printed wiring board 30 is crimped to the pressure sensor chip 20 and the circuit chip 1. Wires (32a and 32b) of the flexible printed wiring board 30 are joined to pads (26a and 26b) of the pressure sensor chip 20 and the pad (4a) of the circuit chip 1. Their joined parts are sealed with the sheet 31 made of a resin of the flexible printed wiring board 30. COPYRIGHT: (C)2006,JPO&NCIPI
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