| 摘要 |
PROBLEM TO BE SOLVED: To provide an imaging apparatus capable of suppressing the lowering of image quality and deterioration in an output characteristic caused when the thickness of a wafer of a solid-state imaging element is reduced. SOLUTION: The imaging apparatus for processing a luminance signal outputted from a plurality of light receiving elements and outputting image information includes: at least a single stage of output circuit; and a buffer circuit for applying impedance conversion to the output signal of a final stage of the output circuit to output the image information, the final stage of the output circuit is a source follower circuit, the current source section 5 of the source follower circuit is provided to the outside of the solid-state imaging element 1 including a plurality of the light receiving elements, and the current source section 5 includes: resistance division circuits 7, 8 for applying resistance division to a prescribed constant voltage and outputting a division voltage from a resistance division point; an emitter grounded transistor 9 whose base electrode receives the division voltage and whose collector electrode is connected to the output line of the solid-state imaging element 1; and a capacitor 12 connected between the resistance division point and a prescribed electric level and suppressing voltage variations of the base electrode depending on the signal frequency of the output signal from the solid-state imaging element 1. COPYRIGHT: (C)2006,JPO&NCIPI
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