| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a reliable ceramic circuit board that effectively eliminates cracks, even after a long cooling cycle, i.e., has proper characteristics in thermal resistance cyclability. SOLUTION: This method for manufacturing a ceramic circuit board 1 comprises a step of forming a silver-copper brazing filler metal layer 5, having at least one kind of active metal selected from among Ti, Zr, Hf, V, Nb and Ta, a step of jointing a nitride ceramic substrate 2 and a metal circuit board 3 via this brazing filler metal 5, and ensures a Vickers hardness of 1,100 or higher for a reaction product layer 6 to be produced as the result of reaction of the silver-copper brazing filler metal layer 5 and the nitride ceramic substrate 2. COPYRIGHT: (C)2006,JPO&NCIPI
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