| 摘要 |
A hermetically sealed micro-device package encapsulating a micro-device and including a transparent window allowing light to pass into and out of a cavity containing the micro-device comprises a semiconductor substrate having a micro-device operably disposed thereupon. The substrate has a first frame-attachment area formed thereupon having a plan that circumscribes the micro-device. A sheet of transparent material has a window aperture portion defined thereupon, the sheet having a second frame-attachment area formed thereupon having a plan that circumscribes the window aperture portion. A frame/spacer is positioned between, and hermetically bonded to, the semiconductor substrate and the transparent sheet, the frame/spacer including a continuous sidewall having a plan on one side substantially corresponding to, and substantially in register with, the plan of the first frame-attachment area, having a plan on the opposite side substantially corresponding to, and substantially in register with, the plan of the second frame-attachment area, and having a height that exceeds the height of the micro-device.
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