| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit device that is appropriate for connecting a plurality of laminated wiring layers through an insulating layer. <P>SOLUTION: In the manufacturing method of a hybrid integrated circuit device 10, a first conductive layer 28A is laminated by patterning the first conductive layer 28A via a first insulating layer 17A, so as to form a first wiring layer 18A. A first connection section 25A projecting in the thickness direction is formed in the first wiring layer 18A. Further, the first wiring layer 18A including the first connection section 25A is covered with a second insulating layer 17B. The second insulating layer 17B comprises a first resin film 17B1 and a second resin film 17B2. A smaller amount of inorganic filler than that of the first resin film 17B1 is contained in the second resin film 17B2, thus easily forming a through hole 32. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
