MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To easily peel a thin semiconductor wafer from an adhesive tape by suppressing sticking of a glue when performing a wet process under the condition where the adhesive tape which can be peeled by thermal foaming is pasted over the entire main surface of the semiconductor wafer, and foaming the adhesive tape by heating after the wet process. SOLUTION: An adhesive tape 31 which can be peeled by thermal foaming is pasted over the entire main surface of a wafer 21. The adhesive tape 31 is cut along the periphery of the wafer 21 by moving a blade 101 of a cutter relative to the periphery of the wafer 21, under such condition as the tip of blade of the tape cutter is oriented outward with the center of the wafer 21 as a center position while the blade 101 of the tape cutter contacting to the periphery of the wafer 21. The wafer 21 is peeled off the adhesive tape 31 by heating the adhesive tape 31 for foaming after the wet process. COPYRIGHT: (C)2006,JPO&NCIPI