| 摘要 |
PROBLEM TO BE SOLVED: To prevent such an edge short circuit that a substrate is deformed by heat and pressure when thermocompression bonding is carried out, and wiring and a semiconductor device on a substrate contact to each other, in a semiconductor apparatus having a COF structure. SOLUTION: By extending an insulating layer 5 coating the substrate 3 and the wiring 4 to a lower side of the semiconductor device 1, even if the substrate deforms and the wiring is in contact with the semiconductor device at a part except a bump electrode by thermocompression bonding, since the wiring is coated with the insulating film, a occurrence possibility of the edge short circuit becomes low. COPYRIGHT: (C)2006,JPO&NCIPI
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