| 摘要 |
PROBLEM TO BE SOLVED: To provide a susceptor capable of achieving the uniformity of characteristics in a wafer surface without needing to differentiate thickness with other parts. SOLUTION: The susceptor has a structure in which the surface of a first susceptor part 1A is covered with a same material with the wafer 2 or a second susceptor part 5 having same specific heat. COPYRIGHT: (C)2006,JPO&NCIPI
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