发明名称 Memory metal springs for heatsink attachments
摘要 An assembly for a computer system is mountable on a circuit board of a computer system. The assembly includes a base portion for engaging with an electronic component mounted on the circuit board. The assembly also includes a spring formed of memory metal. The spring is operable to urge the base portion against the electronic component to urge the electronic component towards the circuit board. The spring is configured to provide a greater spring force for urging the base portion against the electronic component when the spring is above a predetermined temperature than when it is below said predetermined temperature.
申请公布号 US2005277324(A1) 申请公布日期 2005.12.15
申请号 US20040865296 申请日期 2004.06.10
申请人 SUN MICROSYSTEMS, INC. 发明人 GATES WILLIAM G.
分类号 G06F1/18;G06F1/20;H01L23/40;(IPC1-7):H01R12/00 主分类号 G06F1/18
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