| 摘要 |
The invention is a component and method of bonding a ceramic part to a metal part by heating a component assembly comprised of the metal part, the ceramic part, and a thin compact interlayer material placed between the two parts and heated at a temperature that is greater than the temperature of the eutectic formed within the compact interlayer material or between the metal part and the compact interlayer material, but that is less than the melting point of the ceramic part or of the metal part. The component assembly is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a strong bond between the ceramic part and the metal part. The compact interlayer material may be further comprised of two or more sets of metal alloy particles each having distinct compositions.
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