Single component pad backer for polishing head of an orbital chemical mechanical polishing machine and method therefor

摘要

A pad backer for a polishing head of an orbital chemical mechanical polishing (CMP) machine is formed of a flexible pad. A plurality of holes are formed through the flexible pad. The holes are used to accommodate tile flow of a polishing liquid from the underside of the flexible pad. A plurality of grooves are formed on a backside of the flexible pad for transferring a liquid during the polishing process.