| 摘要 |
Methods and systems for electronic design automation includes clustering objects into more manageable numbers of objects. Clustering is optionally performed to reduce or minimize interconnections between clusters. Clustering optionally includes multi-level clustering. The clusters, and any unclustered objects, are floorplanned. Floorplanning positions the clusters so as to reduce or minimize the length of interconnections between the clusters. Objects within the clusters are then placed within the area assigned to the corresponding clusters. Placement optionally utilizes placement-based wire load models to accurately predict timing issues. A bottoms-up procedure is optionally performed during clustering and/or floorplanning, whereby area and/or size constraints of clustered objects are taken into account. |
