发明名称 CHEMICAL AND MECHANICAL POLISHING APPARATUS, CARRIER HEAD AND DIVIDING RING
摘要 <P>PROBLEM TO BE SOLVED: To provide a carrier head having a division ring for dividing a pressure chamber into a plurality of pressure zones, in a chemical and mechanical polishing apparatus. <P>SOLUTION: A carrier head 52 of chemical and mechanical polishing apparatus has a support part, an elastic membrane 300 having a pressure chamber 520 formed between the support part and a bottom face, by being fixed to an annular fixing part and separated from the bottom face of the support part, and at least one dividing ring 400, extending from the bottom face of the support part and composed of an elastic material. Each dividing ring is extended through the pressure chamber 520 and has an annular partition wall 440 for dividing the pressure chamber 520 into pressure zones located on its both sides, and an annular contact portion 460 which comes into contact with the membrane 300, without the dividing ring 400 being fixedly adhered to the membrane 300. The annular contact portion 460 has a pair of annular flanges, extended in a side direction toward mutually opposite direction at a lower edge of the annular partition wall 440. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005347752(A) 申请公布日期 2005.12.15
申请号 JP20050162054 申请日期 2005.06.01
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 BOO JAE-PHIL;LEE JUE-YOUNG
分类号 B24B37/005;B24B37/30;H01L21/304 主分类号 B24B37/005
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