| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inverter device which copes with the improvement in its energization capacity and the downsizing by enhancing the cooling efficiency of a semiconductor device for power, and besides is excellent in manufacturability. <P>SOLUTION: This inverter device is equipped with a semiconductor chip which constitutes one arm of the inverter, a first conductor 33 which joins the positive electrode side of this semiconductor chip, and a second conductor 35 which joins the negative electrode side of the semiconductor chip concerned. The above first conductor 33 and the above second conductor 35 are arranged above a cooler 22 so that the junction plane between the positive electrode of the above semiconductor chip and the first conductor 33 and the junction plane between negative electrode of the above semiconductor chip and the above second conductor 35 may be severally nonparallel with the surface of he above cooler 22 which cools the above semiconductor chip. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
