发明名称 HOLLOW STRUCTURE ELEMENT, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To manufacture a hollow structure element having high durability by preventing the first and secondary stictions. <P>SOLUTION: A structure 2 is provided through a sacrifice layer imbedded in a recessed portion 10a provided on a base plate 10, and a hollow structure element 1 structures a hollow space S in the recessed portion 10a by etching the sacrifice layer. On an inner surface of the recessed portion 10a, a thin film 11 made from material capable of forming a predetermined product by reacting with etchant etching the sacrifice layer is provided. The manufacturing method forms the thin film 11 made from the material capable of forming the predetermined product by reacting with the etchant etching the sacrifice layer on the inner surface of the recessed portion 10a, after forming the recessed portion 10a on the base plate 10, and imbeds the sacrifice layer through the thin film 11. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005342817(A) 申请公布日期 2005.12.15
申请号 JP20040163053 申请日期 2004.06.01
申请人 SONY CORP 发明人 MITARAI TAKASHI;TANAKA NAOHIRO;TADA MASAHIRO;NANBADA KOJI;AISAKA TSUTOMU
分类号 B81C1/00;H01L41/09;H01L41/18;H01L41/187;H01L41/22;H03H3/02;H03H9/17 主分类号 B81C1/00
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