| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To favorably improve junction performance of soldering selectively to junction parts of a heat pipe only without performing plating work. <P>SOLUTION: The heat pipe 11 to carry heat is jointed with a guide groove 18 in a heat sink 1, a guide groove 12 in a heat receiving part 4, and a junction part 16 in a heat radiation part 15. Film comprising metal material having favorable wettability to solder is spray-coated on the guide grooves 12 and 18 and the junction part 16. Thus, by only spray-coating the film comprising metal material having favorable wettability to solder to the guide grooves 12 and 18 and the junction part 16, solder junction with the heat pipe 11 can be favorably achieved. The film can be selectively formed only on the guide grooves 12 and 18 and the junction part 16 as parts requiring soldering by spray-coating. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
