| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface acoustic wave device capable of making miniaturization and sealing compatible. SOLUTION: There are provided a piezoelectric substrate 26; an element chip 20 including IDTs 23a, 23b, 24a, 24b and electrode terminals 25a-25f electrically connected to the IDTs 23a, 23b, 24a, 24b and disposed along with the edge of the piezoelectric substrate 26; a base substrate which is disposed while predetermined spacing away from a surface of the element chip 20 whereon the electrode terminals 25a-25f are disposed, and with which a land is formed in a portion facing the electrode terminals 25a-25f; conductive adhesives 28a-28f disposed between the electrode terminals 25a-25f of the element chip 20 and the land of the base substrate for adhering the electrode terminals 25a-25f and the land while electrically connecting them; and an insulated adhesive disposed along overall edges between the element chip 20 and the base substrate for adhering the element chip 20 and the base substrate while electrically insulating them. COPYRIGHT: (C)2006,JPO&NCIPI
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