| 摘要 |
PROBLEM TO BE SOLVED: To prevent a spacer from being peeled from the semiconductor substrate of a solid-state image pickup device by vibration, shock, thermal expansion, or the like. SOLUTION: In the solid-state image pickup device 20 in a WLCSP type, a groove 34 is formed on an adhesive surface 27b of a spacer 27 for surrounding the periphery of a solid-state image pickup element. When joining the spacer 27 to a semiconductor substrate 26 by an adhesive 29, the adhesive 29 enters the groove 34, thus increasing the coated area of the adhesive 29 by the amount of vertical surfaces 34a, 34b of the groove 34, thus improving the adhesion strength between the spacer 27 and the semiconductor substrate 26, and preventing the spacer 27 from being peeled from the semiconductor substrate 26 even if an optical unit is applied to cover glass 28 and a load is applied to the adhesive section of the spacer 27. COPYRIGHT: (C)2006,JPO&NCIPI
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