发明名称 METHOD AND DEVICE FOR MANUFACTURING SEMICONDUCTOR THIN FILM
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor thin film having a wide needle crystal grain for providing a semiconductor device having a stable characteristic. SOLUTION: In the manufacturing method of the semiconductor thin film, the semiconductor thin film is melted and crystallized by irradiation of a laser beam. A main laser beam and a plurality of auxiliary laser beams different in irradiance are irradiated. The main laser beam has irradiance melting the semiconductor thin film and the auxiliary laser beam has irradiance which is smaller than that of the main laser beam and melts the semiconductor thin film, and a periphery of an irradiation region of the main laser beam is irradiated with the auxiliary laser beam. In the manufacturing method, it is desirable that irradiance of the auxiliary laser beam with which a region far from the irradiation region of the main laser beam is irradiated is smaller than that of the auxiliary laser beam with which a region near the irradiation region of the main laser beam is irradiated. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005347380(A) 申请公布日期 2005.12.15
申请号 JP20040162982 申请日期 2004.06.01
申请人 SHARP CORP 发明人 SEKI MASANORI;INUI TETSUYA;TANIGUCHI KIMIHIRO
分类号 H01L21/20;H01L21/336;H01L29/786;(IPC1-7):H01L21/20 主分类号 H01L21/20
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