| 摘要 |
A micro-electro-mechanical system (MEMS) package with a spacer for sealing and a method of manufacturing the package are disclosed. The MEMS package and method of the present invention hermetically and reliably seals MEMS elements from an external environment, including temperature, humidity, impact and vibration, by a sealing unit which has a spacer integrated with a lid glass to secure an MEMS moving space where the MEMS elements are free to move vertically. The present invention simplifies the process of manufacturing the MEMS package and prevents solder from flowing into the package. The MEMS package and method according to the present invention also allow a reworking process, such as for adding solder, to be executed when the sealing is not complete due to inaccurate positioning of the solder and/or application of a deficient amount of solder to a junction between the base substrate and the lid glass.
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