发明名称 |
High frequency multilayer integrated circuit |
摘要 |
A high frequency multilayer integrated circuit is provided with: a multilayer board including n earth conductor layers (n: integer of two or more than two) and (n-1) dielectric layers each arranged between adjacent earth conductor layers; a first high frequency circuit disposed in one of the most outside earth conductor layers of the multilayer board; a first power-supply/control circuit disposed in this most outside earth conductor layer; a second high frequency circuit disposed in at least one of the dielectric layers and connected to the first high frequency circuit in the multilayer board; a second power-supply/control circuit disposed in another one of the most outside earth conductor layers of the multilayer board; and a third power-supply/control circuit disposed in at least one of the dielectric layers at a portion at which the second high frequency circuit does not exist, the third power-supply/control circuit being connected to the first and second power-supply/control circuits. |
申请公布号 |
US2005275078(A1) |
申请公布日期 |
2005.12.15 |
申请号 |
US20050147332 |
申请日期 |
2005.06.08 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
SUZUKI RYOTA;NAKADA TAIHEI;KUMAMOTO TSUYOSHI;YAMASHITA YUUSUKE |
分类号 |
H01L23/12;H01L23/02;H01L23/50;H01L23/552;H01L23/66;H05K1/00;H05K1/02;H05K1/11;H05K1/18;H05K3/46;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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