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发明名称
LEAD ON CHIP SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD THEREOF AND JIG FOR MANUFACTURING THEREOF
摘要
申请公布号
KR20050118085(A)
申请公布日期
2005.12.15
申请号
KR20040093481
申请日期
2004.11.16
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
LEE, CHAN SUK;OH, SE YONG;LEE, SANG HYEOP;KWAK, MIN KEUN;KIM, JIN HO;YOON, SUNG SWAN;NAM, TAE DUK
分类号
H01L23/28;(IPC1-7):H01L23/28
主分类号
H01L23/28
代理机构
代理人
主权项
地址
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