| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device capable of improving productivity, by simplifying an assembling process. SOLUTION: The manufacturing method of the electronic device prepares a mother board which has two or more substrate regions arranged in a matrix form. It includes a process for mounting an electronic-parts element in a recess formed in each base substrate region of the mother board, a process for laying/joining a lid body which seals electronic-parts elements at the level difference provided in the opening of the recess of the substrate region, and a process C for obtaining two or more electronic devices simultaneously by cutting integrally the periphery of the lid body mounted section of the level difference formed in the opening of each substrate region of the mother board. COPYRIGHT: (C)2006,JPO&NCIPI
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