发明名称 SOLID-STATE IMAGING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a solid-state imaging device with an excellent protective operation for preventing an insulating film or bonding inside an apparatus from being destroyed by static electricity. SOLUTION: In a solid-state imaging device including a protection circuit connected to a terminal, there are included a first circuit connected between the terminal and a negative potential line for providing a negative voltage, a second circuit connecting a protection circuit between the terminal and a ground potential line and a third circuit forming a protection circuit between the ground potential line and another terminal. The protection circuit is comprised of a first MOS transistor of which the drain is connected to the terminal, a source is connected to the negative potential line and a gate is connected to the terminal or the negative potential line, a second MOS transistor of which the drain is connected to the terminal, a source is connected to the ground potential line, and a gate is connected to the terminal or the ground potential line, and a third MOS transistor of which the drain is connected to the other terminal, a source is connected to the ground potential line and a gate is connected to the terminal or the ground potential line. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005348422(A) 申请公布日期 2005.12.15
申请号 JP20050172486 申请日期 2005.06.13
申请人 SHARP CORP 发明人 KAMIMURA SHINYA
分类号 H01L27/14;H01L21/822;H01L27/04;H01L27/06;H04N5/335;H04N5/369;H04N5/372;H04N5/376;(IPC1-7):H04N5/335 主分类号 H01L27/14
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