发明名称 METHOD FOR PRODUCING PLATING MATERIAL AND ELECTRICAL/ELECTRONIC COMPONENT USING THE PLATING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a method for producing a plating material having both of satisfactory heat resistance and insertion-extraction properties, and to provide its production method. SOLUTION: In the method for producing a plating material, on the surface of an electrically conductive substrate 1, a substrate layer 2 composed of either one kind of metal in the groups 4, 5, 6, 7, 8, 9 and 10 or an alloy consisting essentially of the same, an intermediate plating layer composed of Cu or a Cu alloy, and a surface plating layer composed of Sn or an Sn alloy are formed in this order, and thereafter, the intermediate plating layer is vanished, e.g., by heating treatment, so as to form a layer 3' composed of an Sn-Cu intermetallic compound. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005344188(A) 申请公布日期 2005.12.15
申请号 JP20040167514 申请日期 2004.06.04
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 TANAKA HITOSHI
分类号 C25D7/00;C25D5/12;C25D5/50;(IPC1-7):C25D7/00 主分类号 C25D7/00
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