VERFAHREN ZUM HERSTELLEN VON LÖCHERN IN EINER MEHRLAGENLEITERPLATTE

摘要

Multilayered conductor plate (1) comprises at least two copper layers (2, 3) separated by a dielectric layer (4). The first copper layer forming the outer side of the conductor plate is provided with a coating (5) whose CO2 laser irradiation absorption is greater than the CO2 laser irradiation absorption of the outer side of the first copper layer, or with a surface structure increasing the CO2 laser irradiation absorption. An Independent claim is also included for a process for producing holes (7) in the copper layer forming the outer side of the above multilayered conductor plate and in a dielectric layer using laser irradiation. The coating is an organometallic coating.