| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin precursor composition, in which the coefficient of thermal expansion is small and therefore, decrease in adhesiveness with a substrate, warpage of the substrate or the like are prevented to be able to form a resin film which is prevented from deterioration in electrical characteristics, resolution or the like. <P>SOLUTION: The positive polyimide precursor composition comprises a polyimide precursor containing a benzoxazole skeleton in the main chain and a phenolic hydroxyl group in at least either the main chain or a side chain; and a photosensitive dissolution inhibitor. Since the positive polyimide precursor composition has a small coefficient of thermal expansion after polyimidization, the composition shows little difference in the coefficient of thermal expansion from a substrate, having a low coefficient of thermal expansion, such as a silicon wafer after the composition is applied on the substrate and thermally cyclized, shows preferred adhesion property with the substrate, reduces warpage and keeps preferred developing properties, photosensitivity, or the like. As a result, a preferable pattern can be obtained. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
