| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device in which unique information bits are easily recorded for each chip. <P>SOLUTION: This method for manufacturing a semiconductor device comprises a first process to write information bits different for each wafer in N-1 pieces of information blocks among N pieces of information blocks, and a second process to write information bits different for each chip in one remaining information block among the N information blocks by using a wafer mask common to all wafers in order to record unique information bits different for each chip. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
