| 摘要 |
PROBLEM TO BE SOLVED: To provide a one-pack type epoxy resin composition which can have both high curability and high storage stability, to provide a latent curing agent for obtaining the same, and to provide an anisotropic conductive material, a conductive adhesive material, an insulating adhesive material, a sealing material, or the like which has high storage stability and has high connection reliability, adhesive strength, and high sealability, even in a low temperature or short time curing condition. SOLUTION: This latent curing agent (A) covered with a coating film obtained by reacting (b1) an isocyanate compound whose 20 mass % or more is an adduct type aliphatic polyisocyanate, with (b2) an active hydrogen compound. And a one-pack type epoxy resin composition using the composition. COPYRIGHT: (C)2006,JPO&NCIPI
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