| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal pattern formation method by which a metal pattern non-formation portion can be easily removed by etching when forming a metal pattern by etching and a good adhesiveness of the formed metal pattern can be achieved. SOLUTION: The metal pattern formation method comprises a process (a) of forming a graft polymer directly bonding with the surface of a base material on the base material, a process (b) of forming a metal film by adhering a conductive material to the graft polymer, and a process (c) of etching the metal film. It is preferred that the metal film is formed by electroless plating. COPYRIGHT: (C)2006,JPO&NCIPI
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