摘要 |
PROBLEM TO BE SOLVED: To provide a technique for suppressing production of whiskers from tin/tin alloy solder. SOLUTION: In tin (tin alloy) plating layers provided on a substrate, as the lower layer, a tin (tin alloy) lusterless plating layer is provided, and, as the upper layer, a tin (tin alloy) lustrous plating layer is provided. It is also possible that the diffusion of a Cu component is prevented by a barrier plating film. COPYRIGHT: (C)2006,JPO&NCIPI
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