发明名称 METHOD FOR SUPPRESSING PRODUCTION OF WHISKER FROM TIN OR TIN ALLOY PLATING LAYER, AND CONTACT MEMBER
摘要 PROBLEM TO BE SOLVED: To provide a technique for suppressing production of whiskers from tin/tin alloy solder. SOLUTION: In tin (tin alloy) plating layers provided on a substrate, as the lower layer, a tin (tin alloy) lusterless plating layer is provided, and, as the upper layer, a tin (tin alloy) lustrous plating layer is provided. It is also possible that the diffusion of a Cu component is prevented by a barrier plating film. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005344157(A) 申请公布日期 2005.12.15
申请号 JP20040164606 申请日期 2004.06.02
申请人 YUKEN INDUSTRY CO LTD 发明人 OIWA KAZUHISA;KUSUNOKI YOSHINORI
分类号 C25D5/10;(IPC1-7):C25D5/10 主分类号 C25D5/10
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