发明名称 |
Lead-free bonding systems |
摘要 |
Nano-structured interconnect formation and a reworkable bonding process using solder films. Large area fabrication of nano-structured interconnects is demonstrated at a very fine pitch. This technology can be used for pushing the limits of current flip chip bonding in terms of pitch, number of I/Os, superior combination of electrical and mechanical properties as well as reworkability. Sol-gel and electroless processes were developed to demonstrate film bonding interfaces between metallic pads and nano interconnects. Solution-derived nano-solder technology is an attractive low-cost method for several applications such as MEMS hermetic packaging, compliant interconnect bonding and bump-less nano-interconnects.
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申请公布号 |
US2005274227(A1) |
申请公布日期 |
2005.12.15 |
申请号 |
US20050138011 |
申请日期 |
2005.05.26 |
申请人 |
GEORGIA TECH RESEARCH CORPORATION |
发明人 |
AGGARWAL ANKUR;ABOTHU ISAAC R.;RAJ PULUGURTHA M.;TUMMALA RAO R. |
分类号 |
B23K35/00;B23K35/26;B23K35/34;C22B3/24;H01L21/288;H01L21/60;H01L21/768;(IPC1-7):C22B3/24 |
主分类号 |
B23K35/00 |
代理机构 |
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代理人 |
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地址 |
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