发明名称 LASER BEAM MACHINING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining method, by which a hole excellent in quality is efficiently machined. <P>SOLUTION: The diameter of a beam spot is set on≤25μm. Under the machining condition that the average output for a copper conductor layer is≥100 mW and the average output for an insulating layer is≤100 mW, each of the layers is machined. The average output is controlled by keeping the output of a laser source emitting a pulse laser beam constant and by controlling the frequency and the irradiation number of the laser beam with which a machining part is irradiated. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2005342749(A) 申请公布日期 2005.12.15
申请号 JP20040163900 申请日期 2004.06.01
申请人 HITACHI VIA MECHANICS LTD 发明人 ARAI KUNIO
分类号 B23K26/00;B23K26/38;B23K101/42;B23K103/16;H05K3/00;H05K3/46;(IPC1-7):B23K26/00 主分类号 B23K26/00
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