发明名称 LASER BEAM MACHINING APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus, whose machining accuracy is kept high without replacing a suction plate, by preventing damage to a suction plate constituting a workpiece loading mechanism part, which damage is caused by a thermal effect due to laser beam irradiation in machining. <P>SOLUTION: The laser beam machining apparatus is provided with a suction plate 21 having suction holes 21a penetrating in the thickness direction, a suction plate holding member 22 holding the suction plate, and workpiece holding plates 23, which have a plurality of suction holes 23a penetrating in the thickness direction and are placed on the suction plate to hold workpieces 10. The workpieces are attracted and held on the workpiece holding plates by suctioning the workpieces through the suction holes of the suction plate and the suction holes of the workpiece holding plates. The workpiece holding plates are held on the suction plate by arranging a frame member 24 with openings on the suction plate and by fitting the workpiece holding plates into the openings 24a of the frame member. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2005342762(A) 申请公布日期 2005.12.15
申请号 JP20040166294 申请日期 2004.06.03
申请人 MURATA MFG CO LTD 发明人 YAMAMOTO TAKAHIRO;NARUMI MASAHIRO
分类号 B23K26/10;(IPC1-7):B23K26/10 主分类号 B23K26/10
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