| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To efficiently obtain a polishing result as requested even if performing polishing by using slurry for polishing in which a surface active agent is mixed. <P>SOLUTION: The semiconductor manufacturing apparatus comprises polishing means 1, 2 for polishing a surface to be polished in an object to be polished by relatively rubbing the object to be polished and a polishing pad by interposing slurry for polishing in which a surface active agent is mixed and demineralized water; a measuring means 7 for measuring the polished result for the object to be polished after polishing; adjustment means 8, 9, 10 for adjusting the amount of mixture of the surface active agent to the slurry for polishing and the amount of supply of the demineralized water; and a control means 12 for giving an adjustment instruction to the adjusting means 8, 9, 10 according to the measurement result of the polishing result, when the polishing means 1, 2 perform polishing after the measurement of the polishing result by the measuring means 7. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
