发明名称 BONDING DEVICE AND BONDING TOOL
摘要 PROBLEM TO BE SOLVED: To provide a compact bonding device having excellent temperature control precision and low costs, and also to provide a bonding tool. SOLUTION: In the bonding tool 7 for crimping an object to be joined to a surface to be joined while a load and vibration are made to act on the object to be joined, a heater 19 and a thermocouple 20 are fitted into fitting holes 8g and 8h provided along the longitudinal direction of horn 8, respectively, and the temperature when the heater 19 heats an joint operation section 10 is measured by the thermocouple 20, thus precisely measuring the temperature at the joint operation section 10 as compared with a conventional system for measuring the surface temperature of the horn without any contact, and achieving the compact bonding tool having excellent temperature control precision and low costs. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005347505(A) 申请公布日期 2005.12.15
申请号 JP20040165283 申请日期 2004.06.03
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HISAKU MASAFUMI;TAKAHASHI SEIJI
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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