| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC socket capable of restraining warpage generated when mounting on a base board. SOLUTION: The IC socket comprises a cover housing 22 on which a terminal insertion holes 22a for inserting terminals 15a of an IC package 15 are perforated; contacts 20 having a terminal insertion hole 21a into which, the terminal 15a is inserted while passing through the terminal insertion hole 22a; a base housing 21 slidably holding the cover housing 22; an operation lever 23 making the cover housing 22 slide interlocked with rotating operation between pressure contact locking positions locking the terminal 15a on the inner wall face of the terminal insertion hole 21 in pressure contact state and the pressure contact releasing position releasing the pressure contact state, and a pad mounting part 22b on which a suction pad 25 is mounted having a lever holding part 25a fixing and holding the operation lever 23 in an intermediate slanted posture between toppled attitude and standing attitude, and a suction part 25c sucked by a suction device. COPYRIGHT: (C)2006,JPO&NCIPI
|
