发明名称 Semiconductor device and method of manufacturing the same
摘要 The present invention provides a method of manufacturing an ESD protection device with a gate electrode structure that reduces surge voltage applied to a gate insulating film and inhibits destruction of the gate insulating film. A method of manufacturing a semiconductor device includes steps of preparing a support substrate, forming a device region and a device-separation region on the support substrate, forming a gate insulating film in the device region, forming a first gate electrode on the gate insulating film, implanting a first impurity ion into the first gate electrode, and decreasing a first impurity ion concentration by implanting a second impurity ion with a polar character, which is opposite from that of the first impurity ion, into the first gate electrode.
申请公布号 US2005275030(A1) 申请公布日期 2005.12.15
申请号 US20040989011 申请日期 2004.11.16
申请人 OKI ELECTRIC CO., LTD. 发明人 HAYASHI HIROKAZU
分类号 H01L27/04;H01L21/336;H01L21/822;H01L27/06;H01L29/78;H01L29/786;(IPC1-7):H01L21/336 主分类号 H01L27/04
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