发明名称 |
Contact sensor package structure |
摘要 |
A contact sensor package has a substrate, a film, a sealant and a plurality of contact sensors disposed on the substrate. The contact sensors are disposed within the enclosed space defined by the substrate, the film and the sealant. The contact sensor package further has at least a ground conductive trace formed on the substrate and an electrostatic charge dissipation layer formed on a surface of the film and electrically connected to the ground conductive trace. The electrostatic charge dissipation layer has an upper surface that serves as a contact surface for a detecting a contact work-piece.
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申请公布号 |
US2005274597(A1) |
申请公布日期 |
2005.12.15 |
申请号 |
US20040868496 |
申请日期 |
2004.06.14 |
申请人 |
LEE SHIH-CHANG;LEE CHENG-YIN;LU YUNG-LI;YEH YING-TSAI;LIN PEI-CHI |
发明人 |
LEE SHIH-CHANG;LEE CHENG-YIN;LU YUNG-LI;YEH YING-TSAI;LIN PEI-CHI |
分类号 |
H03K17/975;(IPC1-7):H03K17/975 |
主分类号 |
H03K17/975 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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