发明名称 Heat dissipation assembly with air guide device
摘要 A heat dissipation assembly includes a heat sink, a fan attached to the heat sink, for providing forced airflow to the heat sink; and an air guide device, adapted for leading air between the fan and an air exchange port. The air guide device includes an immovable duct, having one end attached to the fan, a movable duct, connecting to the immovable duct and capable of moving relative to the immovable duct, and spring members arranged between the immovable duct and the movable duct to impel the movable duct relative to the immovable duct, such that a height of the air guide device is adjustable expediently.
申请公布号 US2005274498(A1) 申请公布日期 2005.12.15
申请号 US20050137178 申请日期 2005.05.25
申请人 FOXCONN TECHNOLOGY CO., LTD. 发明人 LI DONG-YUN;LI MIN;SHI HONG-BO
分类号 G06F1/20;H01L23/467;H05K7/20;(IPC1-7):H05K7/20 主分类号 G06F1/20
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